Customers in the precision electronics manufacturing industry face challenges when reinforcing solder joints between FPCs (flexible printed circuit boards) and fine wires. Due to the frequent stress and limited space at the wire roots, traditional adhesives cure too slowly at room temperature and cannot guarantee the encapsulation strength of each solder joint.

We equip our clients' automated dispensing production lines with high-intensity UV LED curing light sources:

• Synchronous Operation: The curing lamp head closely follows the dispensing needle, achieving "dispensing and curing simultaneously," eliminating glue dripping.
• Precise Focusing: Optimized light spot using optical lenses concentrates energy in a critical 3mm-5mm area, protecting surrounding heat-sensitive components.
• Deep Curing: 365nm high radiation intensity ensures light penetrates to the bottom of black or semi-transparent wires, achieving 100% deep curing.
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Application Results:

• Rapid Production: Single-point curing time reduced from minutes to 0.8-1.2 seconds.
• Improved Physical Properties: Wire pull-off force increased by 25%, ensuring solder joints are resistant to bending.
• Compact Production Line: Eliminating the lengthy baking tunnel oven reduces the production line footprint by 40%.